This part is a kind of semiconductor called 84-1LMISR4.

Function of this product has ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE.

Manufacturers : ETC

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Some of the text within the PDF file :

TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell ABLEBOND® 84-1LMISR4 times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry. FEATURES • Excellent dispensability with minimal tailing and stringing • Box oven cure Test Method ATM-0018 ATM-0089 ATM-0067 ATM-0068 Test Description 10 x 10 mm Si die on glass slide Test Method ATM-0031 Typical Uncured Properties Filler Type Viscosity @ [ ... ]

84-1LMISR4 PDF Datasheet Download